Israel and the United States launched preemptive strikes on Iran on Saturday morning, with blasts heard in Tehran as Israel entered a state of emergency. Satellite images revealed a strike in the ...

Abstract: The increasing demand for higher functional density in microelectronics necessitates the miniaturization of interconnects in 3D integration, which presents challenges in processing and ...

ABSTRACT: With the rapid development of hydrogen energy, hydrogen storage alloys have attracted wide attention owing to their key advantages, such as high volume density, proper plateau pressure, ...

The formation and growth of intermetallic compounds at the interface between four solder alloys, Sn-3.5Ag, Sn-0.7Cu, Sn-3.2Ag0.8Cu and Sn-9Zn, and Cu-plated substrates have been studied. Thermal aging ...

The upper half part illustrates electronic properties induced by metallic bonding and covalence in semimetal-platinum based intermetallic compounds. In the bottom half part, the categories and ...

School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China Shunde Innovation School, University of Science and Technology Beijing, Foshan 528399, ...

The insights into the formation of various phases, including intermetallic compounds, at the interface between nickel (Ni) and tungsten (W) can lead to the development of advanced high-temperature Ni- ...

The insights into the formation of various phases, including intermetallic compounds, at the interface between nickel (Ni) and tungsten (W) by researchers from Tokyo Tech can lead to the development ...