As the semiconductor world excitingly explores the potential of new advanced package solutions for their intricate and novel designs, challenges arise from undetected defects caused by the complexity ...

The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are ...

Amkor Technology Inc. company and executive profile by Barron's. View the latest AMKR company infomation and executive bios.

System incorporates pulse generator to investigate fault modes like charge trapping and self heating The first such system on the market to integrate accurate and reliable pulse and dc ...

December 12, 2011. Mentor Graphics Corp. has announced what it calls the electronic industry’s first combined technology for thermal characterization and simulation with T3Ster® hardware test products ...