Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...

Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...

Taiwan’s IC packagers are saying Intel has made arrangements in Taiwan to package its DDR Brookdale 845 chipset with flip-chip technology. The chipset is scheduled for release in the first quarter of ...

Amkor Technology (AMKR) climbed alongside semiconductor peers after the Philadelphia Semiconductor Index advanced, supported by a market report on flip chip packaging growth prospects and a recent ...